thermal coefficient of expansion

On the basis of experiments, the affecting factors of the thermal expansion coefficient of low thermal expansion, high thermal conductivity composite Cu/ FeNi made by powder metallurgy have been investigated.

在实验的基础上研究了低膨胀高导热Cu／FeNi粉末冶金复合材料膨胀性能的影响因素。

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Test method for coefficient of cubical thermal expansion of plastics

塑料热膨胀系数测定法

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The LaFe_xNi_ ( 1-x) O_3 thermal coefficient of expansion was measured by PCY model high temperature horizontal expansion apparatus.

利用PCY型材料热膨胀系数测试仪测量了LaFe xNi（1-x）O3系列材料的热膨胀系数。

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It is suggested that the linear thermal expansion coefficient plays an important role in bonding process through contrast test of anodic bonding between K4 glass and aluminum.

通过K4玻璃与铝片焊接的对比试验，说明材料的线膨胀系数对焊接过程产生了极大的影响。

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In contrast with metal and thermoplastic material, which has a higher coefficient of thermal expansion ( CTE).

相较于金属和热塑材料，什么材料具有更高的热膨胀系数（CTE）？

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Two methods are established to predict the thermal expansion coefficient of Unidirectional composite based on micro-mechanics.

基于细观力学方法建立了两种预测单向复合材料的热膨胀系数的方法.

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The thermal deformation calculation on base definition of expansion coefficient is analyzed.

本文从热膨胀系数基本定义出发对热变形计算进行了较深入分析.

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The result indicated that thermal coefficient of expansion between layers resulted in the residual stress.

结果表明层间的热膨胀系数差异导致了其间的残余应力，并且应力的分布与厚度比例和温度差有关。

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Hollow glass bead ( HGB) is a new type of lightweight inorganic non-metallic materials, with the advantages of low density, low thermal conductivity, low coefficient of expansion and high compressive strength.

空心玻璃微珠（HGB）是一种新型的轻质无机非金属材料，具有低密度、低导热系数、低膨胀系数、高抗压强度等优点。

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The selection of thermal expansion coefficient is of vital importance to the correction of thermal error.

材料膨胀系数的选用对精密机械热误差修正的结果好坏有着决定性的影响.

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The coefficient of thermal expansion ( CTE ) is very important for studies of composite and thermo-mechanical analysis.

本文采用激光散斑干涉法测量微电子金属封装用金属复合 引线 的热膨胀系数.

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A micromechanical model was proposed to predict the thermal expansion coefficient of composite.

建立了一种细观力学模型用于预报复合材料的有效热膨胀系数.

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Relationship between thermal expansion coefficient of slag and components of agglomerative flux

熔渣线膨胀系数与焊剂成分之间的关系

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Physical denotation of thermal expansion coefficient of low thermal expansion superalloys

低膨胀高温合金膨胀系数的物理表征

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Conventional printed wiring boards ( PWBs) are not satisfactory substrates for LCCCs because the mismatch in thermal coefficient of expansion ( TCE) causes solder joints to crack.

普通印制板（PWB）对于无引线陶瓷芯片载体不是满意的基板，因为热膨胀系数（TCE）不匹配能引起铅焊处开裂。

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This paper suggested that for measuring material coefficient of thermal expansion globe possesses more stability.

经过分析比较,指出球体作为标准样件具有较好的稳定性,有利于获得稳定的材料热膨胀系数值.

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